PLANO, TX, June 25, 2024 – Siemens Digital Industries Software announced today that its ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) product certification, as well as an embedded multi-die interconnect bridge (EMIB) enablement breakthrough that can help mutual customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs much more quickly.

The partners recently certified Siemens’ new Solido SPICE, part of Solido Simulation Suite software for the foundry’s Intel 16 and Intel 18A nodes. An advanced portfolio of AI-accelerated simulators for intelligent IC design and verification, Siemens’ new Solido Simulation Suite provides leading-edge, feature-rich circuit verification for analog, mixed-signal, RF, memory, library IP, 3D-IC and System-on-a-chip (SoC) design.

Intel 18A represents the latest advancement in Intel Foundry’s process technology roadmap, featuring advanced RibbonFET gate-all-around (GAA) transistor architecture and PowerVia backside power delivery technologies to help customers optimize the density and performance of their next-generation products. Intel 18A is ideal for IC designs targeting high growth applications including the High-Performance Computing (HPC), mobile and other demanding and fast-growing applications. Intel 18A and Intel 16 are also now enabled with Open Model Interface (OMI), the industry-standard platform for enabling aging modeling and reliability analyses, supported by Siemens’ Solido Simulation Suite.

“Siemens is committed to collaborating with Intel Foundry to provide our mutual customers with the most advanced technologies possible to leverage when designing highly complex ICs and advanced packaging,” said Amit Gupta, vice president and general manager, Custom IC Verification, Siemens Digital Industries Software. “The certification of Solido SPICE and the availability of the EMIB reference flow for early customers by Intel reinforce our joint commitment to providing mutual customers with highly accurate, next-generation tools that enable innovation required to differentiate and win in highly competitive markets.”

Siemens today also announced the availability of the EMIB reference flow that can help Intel Foundry’s early customers utilize the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. With the delivery of this early-adoption Intel Foundry EMIB workflow, Intel Foundry’s customers can tackle the full range of critical tasks needed for a successful design and tape-out. Driven by an Intel Foundry developed and supplied Package Assembly Design Kit (PADK), Intel Foundry’s EMIB customers can also leverage Siemens’ Calibre nmPlatform to validate the EMIB silicon layouts for DRC, LVS, and 3DThermal analysis.

Mutual customers can also conduct package and substrate system planning, design, and verification using Siemens’ Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx SI/PI software, and Calibre 3DSTACK software — leveraging the expertise and world-class technology of Siemens’ industry leading IC and semiconductor packaging portfolios, which provide comprehensive package assembly prototyping and floorplanning with Xpedition Substrate Integrator and predictive shift-left multi-physics analysis from Calibre.

“Intel Foundry is revitalizing the semiconductor industry with new fabrication and highly innovative advanced packaging technologies targeted at taking modern day electronics to entirely new levels. Our collaboration with Siemens for precise EDA enablement is key to nurturing the growing ecosystem,” said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “The recent certification of Siemens’ newly released Solido SPICE, part of Solido Simulation Suite, to run seamlessly on our advanced process technologies underscores the success we’ve seen in our ongoing close collaboration with Siemens. And by developing a certified, production ready EMIB technology reference flow, Intel Foundry and Siemens EDA have delivered yet another major milestone, empowering IC design companies to boldly innovate complex ICs for any electronic application.”

To learn more about Siemens’ offerings in the integrated circuit design industry, visit: https://eda.sw.siemens.com/en-US/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

PLANO, TX, June 25, 2024 – Siemens Digital Industries Software announced a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology. Combining the power of Siemens’ Calibre PERC software with the proven SPICE accuracy of its AI-powered Solido Simulation Suite, it provides a fast and highly accurate method for checking compliance against foundry rules spanning all phases of IC design.

Supporting full-chip level verification, the solution helps engineering teams better manage design and manufacturing challenges in both established and emerging process nodes. Its context-aware checks can help to improve the accuracy of results, while reducing turnaround time for physical, circuit, electrical and reliability IC design verification.

The solution’s context-aware checking allows design teams to verify ESD paths quickly, in time to secure waivers from foundry rules that can lead to smaller die sizes and optimized designs – ultimately helping design teams quickly arrive at data driven decisions 8x faster than current methods.

Foundry ESD rules are designed to prevent ESD failures, while accommodating the diverse design styles submitted by fabless companies globally. However, these rules may be overly conservative for specific design styles and mission profiles. By rapidly identifying and simulating ESD paths that might fail foundry rules with detailed transistor-level breakdown models, this Siemens’ new software identifies at-risk paths with SPICE-level precision, allowing for fast, targeted and automated fixes.

“Siemens’ new context-aware ESD simulation solution can help deliver accurate reliability assessment for complex IC designs,” said Silicon Labs’ Michael Khazhinsky, Principal ESD Engineer of Central R&D. “The push-button solution integrates dynamic simulation results from Solido into a full-chip Calibre PERC result that can be used to quickly determine if designs are electrically robust. In the event of circuit errors, this Siemens solution identifies nets and devices that need to be improved.”

Automated context-aware IC design verification can now become a best practice, helping the quick delivery of reliable and timely IC chips to market. Featuring functionalities such as automated voltage propagation, voltage-aware design rule checking, and the integration of physical and electrical information within a logic-driven layout framework, it helps design teams working to tight schedules.

“By leveraging automated context-aware checking, Siemens is empowering design teams to address more quickly the complexities of modern IC design reliability verification,” said Michael Buehler-Garcia, vice president of Calibre Product Management at Siemens Digital Industries Software.” This integration combines the strengths of our dynamic simulation from Solido and sign-off level ESD verification in Calibre PERC. Our integrated solution speeds up the verification process while at the same time ensuring the reliability of IC designs, helping our customers achieve their goals more efficiently. This is the first in a series of solutions that Siemens plans to provide that leverage offerings from different elements of our software portfolio to speed overall design cycle time.”

For more information about Siemens’ new context-aware ESD verification solution, visit https://eda.sw.siemens.com/en-US/ic/calibre-design/reliability-verification/perc/.

And for further information on this topic, please RSVP for Siemens’ luncheon discussion set for June 25 at DAC 2024 at: https://eda.sw.siemens.com/en-US/eda-events/calibre-dac/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

PLANO, TX, June 25, 2024 – Siemens Digital Industries Software introduced Solido Simulation Suite software (‘Solido Sim’ software), an integrated suite of AI-accelerated SPICE, Fast SPICE and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification tasks for their next-generation analog, mixed-signal and custom IC designs.

Built on the foundation of Siemens’ industry-proven, foundry-certified Analog FastSPICE (AFS) platform, Solido Sim incorporates three innovative new simulators:Solido SPICE software, Solido FastSPICE software and Solido LibSPICE software, as well as Siemens’ market-proven AFS platform, ELDO software and Symphony software.

“Solido Simulation Suite, featuring AI-accelerated SPICE and FastSPICE engines, represents a significant leap forward in custom IC simulation technology, providing unmatched accuracy and efficiency for chip design and verification engineers,” said Michael Ellow, CEO, Silicon Systems, Siemens Digital Industries Software. “Our initial Solido Sim customers have experienced remarkable success across multiple processes technology platforms, all while demonstrating faster runtimes and enabling compelling new capabilities for their next-generation analog, RF, mixed-signal and library IP designs.”

Solido Sim is engineered to help IC design teams meet increasingly stringent specifications, verification coverage metrics and time-to-market requirements. It delivers comprehensive application coverage with best-in-class circuit and System-on-a-Chip (SoC) verification capabilities. Powered by AI technologies, Solido Sim is developed with next-generation process technologies and complex integrated circuit (IC) structures in mind, providing the required toolsets and capabilities to help achieve accurate signal and power integrity goals.

Solido Sim features a simplified use model, accelerated verification and a unified workflow. It delivers a compelling set of innovative new simulation technologies, including:

• Solido SPICE is Siemens’ next-generation, feature-rich SPICE simulation technology, providing a 2-30x speedup for analog, mixed-signal, RF and 3D IC verification. With newer convergence, cache efficient algorithms and high multi-core scalability, Solido SPICE provides a significant performance boost for large pre- or post-layout designs. RF IC developers can directly benefit from Solido SPICE’s new RF verification capabilities, while multi-die, 2.5D, 3D and memory interface developers can now experience an efficient capability for full channel transceiver verification that includesequalization, drastically reducing interface assumptions and accelerating verification.
• Solido FastSPICE is Siemens’ cutting-edge Fast SPICE simulation technology, providing an order-of-magnitude speedup for SoC, memory and analog functional verification. It provides a dynamic use model for SPICE-to-Fast SPICE scaling, providing a scalable interface to help achieve speed goals with predictable accuracy. Solido FastSPICE includes multi-resolution technology for differentiated performance and SPICE-accurate waveforms during critical path analysis for memory and analog characterization.
• Solido LibSPICEis Siemens’ purpose-built batch solver technology for small designs, providing optimized runtimes for Library IP applications. Solido LibSPICE is uniquely integrated into Siemens’ popular Solido Design Environment and Solido Characterization Suite offerings for performance acceleration, enabling a full-flow solution for seamless and robust verification of standard cells and memory bit-cells.

Powering all 3 of these new solvers is Solido Sim AI – the latest version of Siemens’ groundbreaking, AI- accelerated simulation technology. Solido Sim AI is the newest iteration of the AI technology that Solido Design Automation used to pioneer the design and deployment of AI for EDA purposes 15 years ago. With Solido Sim AI, circuit simulation is advanced to the next level with algorithms that are self-verifying and tuned to SPICE accuracy, providing orders-of-magnitude improved acceleration – all accomplished using existing foundry-certified device models without alteration.

Solido Sim integrates natively within Siemens Solido Design Environment and Solido Characterization Suite, offering customers superior performance with optimal accuracy, improved productivity, and scalability across cloud infrastructures. Further, Solido Simulation Suite works closely with Siemens’ industry leading IC sign-off flows Calibre platform Design solutions and Tessent Test solutions as well as Siemens’ electronic systems design and manufacturing PCB solutions, providing full-flow verification solutions across applications.

Availability

The Solido Simulation Suite is now available. To learn more, visit https://eda.sw.siemens.com/en-US/ic/solido/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

About Siemens Digital Industries

Siemens Digital Industries (DI) is an innovation leader in automation and digitalization. Closely collaborating with partners and customers, DI drives the digital transformation in the process and discrete industries. With its Digital Enterprise portfolio, DI provides companies of all sizes with an end-to-end set of products, solutions and services to integrate and digitalize the entire value chain. Optimized for the specific needs of each industry, DI’s unique portfolio supports customers to achieve greater productivity and flexibility. DI is constantly adding innovations to its portfolio to integrate cutting-edge future technologies. Siemens Digital Industries has its global headquarters in Nuremberg, Germany, and has around 72,000 employees internationally.

About Siemens AG

Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, transport, and healthcare. From more resource-efficient factories, resilient supply chains, and smarter buildings and grids, to cleaner and more comfortable transportation as well as advanced healthcare, the company creates technology with purpose adding real value for customers. By combining the real and the digital worlds, Siemens empowers its customers to transform their industries and markets, helping them to transform the everyday for billions of people. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a globally leading medical technology provider shaping the future of healthcare.

In fiscal 2023, which ended on September 30, 2023, the Siemens Group generated revenue of €77.8 billion and net income of €8.5 billion. As of September 30, 2023, the company employed around 320,000 people worldwide. Further information is available on the Internet at www.siemens.com.

PLANO, TX, June 25, 2024 – Siemens Digital Industries Software introduced Calibre 3DThermal, innovative software for thermal analysis, verification and debugging in 3D integrated circuits (3D-ICs). Calibre 3DThermal enables chip designers to rapidly model, visualize and mitigate thermal effects in their designs from early-stage chip and package-inward exploration through to design signoff by incorporating elements of Siemens’ Calibre verification software and Calibre 3DSTACK software along with the company’s Simcenter Flotherm software solver engine. Calibre 3DThermal provides the outputs necessary for thermal impacts to be considered in electrical simulations. Moreover, Calibre 3DThermal can both consume as input boundary conditions as well as provide output to Simcenter Flotherm – enabling true IC to system thermal modeling from IC to package to board to system level.

Calibre 3DThermal was developed to address challenges of 3D-IC architectures where controlling heat dissipation is a key requirement. It offers fast, accurate, powerful and comprehensive approaches to identifying and rapidly addressing complex thermal issues. Calibre 3DThermal provides the flexibility to start initial feasibility analysis with minimal inputs and can later perform more detailed analyses considering metalization details and their impact on thermal considerations as more detailed information becomes available. This progressive approach enables designers to refine their analysis and apply fixes such as floorplanning changes and adding stacked vias or TSVs to avoid thermal hotspots and/or dissipate heat more effectively. This iterative process continues until the final assembly is complete, significantly reducing the risk of performance, reliability and manufacturing issues at final tape-out.

Delivering thermal analysis at this advanced level requires a complete understanding of the 3D-IC assembly. Waiting until the assembly is complete to identify and correct errors can severely disrupt design schedules, but Calibre 3DThermal mitigates this risk through automation and integration, allowing designers to iterate thermal analysis at whichever design stage they are working on.

Calibre 3DThermal embeds a custom version of Siemens’ accurate, industry-trusted Simcenter Flotherm software solver engine to create precise chiplet-level thermal models for static or dynamic simulation of full 3DIC assemblies. Debugging is streamlined through the traditional Calibre RVE software results viewer, which is already integrated across a wide range of IC design tools. The integration of these powerful tools results in an efficient thermal analysis solution tailored to the specific needs of 3DIC designers.

Like all Calibre products, Calibre 3DThermal integrates seamlessly with a range of industry-leading design tools from both third parties, as well as with Siemens’ software including the newly announced Innovator3D IC™ software. In all design flows, Calibre 3DThermal captures and analyzes thermal data across the entire design lifecycle.

“Calibre 3DThermal represents a significant advancement in 3D-IC design and verification, providing designers with the capabilities they need to address thermal challenges early in the design process,” said Michael Buehler-Garcia, vice president, Calibre Product Management, Siemens Digital Industries Software. “By integrating thermal analysis directly into all stages of the IC design flow, we’re enabling our customers to create more reliable, high-performance 3DICs with greater confidence and efficiency.”

Collaboration with UMC

In a collaborative effort, Siemens has joined forces with United Microelectronics Corporation (UMC) to deploy an innovative thermal analysis flow for UMC customers powered by Calibre 3DThermal. This cutting-edge software is tailored specifically for UMC’s wafer-on-wafer and 3D-IC technologies and has been validated and is planned for availability to UMC’s global clientele soon.

“As the semiconductor industry grapples with escalating thermal challenges, particularly in the realm of heat dissipation and thermal gradients within advanced 3D-IC technologies, UMC remains committed to providing effective solutions,” said Osbert Cheng, vice president of device technology development & design support at UMC. “Through our collaboration with Siemens and the implementation of Calibre 3Dthermal, we will be able to offer our customers a comprehensive thermal analysis capability, enabling them to address critical thermal concerns and optimize their designs for enhanced performance and reliability.”

To learn more about Calibre 3DThermal visit https://eda.sw.siemens.com/en-US/ic/calibre-design/3dthermal/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

PLANO, TX, June 25, 2024 – Siemens Digital Industries Software announced Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world.

Siemens’ Innovator3D IC provides a consolidated cockpit for constructing a digital twin — featuring a unified data model for design planning, prototyping and predictive analysis — of the complete semiconductor package assembly. This cockpit drives implementation, multi-physics analysis, mechanical design, test, signoff, and release to manufacturing.

By unifying power, signal, thermal, and mechanical stress analysis tools, it enables rapid ‘what-if’ exploration, while identifying, avoiding and solving challenges prior to detailed design implementation. This shift-left approach can prevent costly and time-consuming downstream rework or suboptimal results.

“Siemens already had the most comprehensive portfolio of semiconductor packaging related technologies available as part of Siemens Xcelerator,” said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. “By combining these with Innovator3D IC we enable customers to achieve the realization of more-than-Moore.”

Innovator3D IC drives ASIC, chiplet and Interposer implementation using Siemens’ Aprisa software digital IC place and route technology, Xpedition Package Designer software, Calibre 3DThermal software, NX software for mechanical design, Tessent Test software, and Calibre 3DSTACK software for interchiplet DRC, LVS and tapeout signoff.

Innovator3D IC uses a hierarchical device planning approach to handle the massive complexity of advanced 2.5D/3D integrated designs with millions of pins. Designs are represented as geometrically partitioned regions with attributes controlling elaboration and implementation methods. This allows critical updates to be quickly implemented while matching analytic techniques to specific regions, avoiding excessively long execution times. Hierarchical interface route path planning further optimizes chiplet interfaces and pin assignments.

Although Innovator3D IC is integrated with the Siemens Xcelerator portfolio of industry software, its open architecture also supports integration with third-party point solutions. A key tenant of Innovator3D IC is its support of industry standard formats, such as 3Dblox, LEF/DEF, Oasis and interface IP protocols (such as UCIe and BoW). Active participation in the Open Compute Projects Chiplet Design Exchange Working Group (OCP CDX) enables direct consumption of standardized chiplet models that will be provided by the emerging commercial chiplet ecosystem.

Innovator3D IC is not limited to 2.5D and 3D integrations, it is capable of planning and prototyping all leading and emerging semiconductor integration methodologies and platforms including interposers (organic, silicon or glass), ABF build-up, RDL based with chips first or last including support for Deca Technologies adaptive patterning process. It is also certified for Panel-Level-Packaging (PLP), embedded or raised silicon bridges as well as System-In-Package (SiP) and modules.

The Innovator3D IC solution is architected around the System Technology Co-Optimization (STCO) methodology process developed by IMEC and utilized throughout prototyping and planning, design, sign-off /manufacturing hand-off, concluding with a comprehensive verification and reliability assessment. Siemens developed Innovator3D IC using the Next Generation Electronics Systems Design (NGESD) AI-infused User eXperience (UX) technology, which uses extensive multithreading and multicore capabilities to achieve optimal capacity and performance on 5+million pin designs.

“For advanced heterogeneous integration platforms such as EMIB, an integrated floorplanning and prototyping cockpit with predictive analysis is essential,” said Suk Lee, VP & GM of Ecosystem Technology Office, at Intel Foundry. “Through our collaboration with Siemens EDA, we see Innovator3D IC as an important design technology component for our advanced integration platforms.”

Innovator3D IC is expected to be available later in 2024. To learn more about Siemens’ Innovator3D IC software, visit https://eda.sw.siemens.com/en-US/ic-packaging/innovator3d-ic/.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.